About the role

AI summarised

The Packages & Solutions Manager (APAC) is a customer-facing technical role in the semiconductor industry, responsible for driving adoption of advanced packaging solutions and managing key accounts in the APAC region. The role involves collaborating with sales, marketing, and R&D teams to develop and execute strategies for packaging products.

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Key Responsibilities

Manage and grow key customer accounts in the APAC region for advanced packaging solutions.
Develop and execute strategic account plans to achieve revenue and market share targets.
Collaborate with sales, marketing, and R&D teams to align product roadmaps with customer needs.
Provide technical support and training to customers on packaging products and processes.
Identify new business opportunities and drive adoption of new packaging technologies.
Monitor market trends and competitive landscape to inform product strategy.
Represent the company at industry conferences and customer meetings.
Coordinate with internal teams to ensure timely delivery of samples and technical documentation.

Requirements

Bachelor's degree in Electrical Engineering, Materials Science, or related field.
Minimum 8 years of experience in semiconductor packaging or related field.
Proven track record in technical sales or account management in the semiconductor industry.
Deep understanding of advanced packaging technologies (e.g., fan-out, 2.5D/3D, SiP).
Strong communication and presentation skills in English; Mandarin is a plus.
Ability to travel frequently within APAC (up to 50%).
Experience working with cross-functional teams and managing complex projects.
Self-motivated with strong problem-solving and analytical skills.
Familiarity with semiconductor supply chain and customer qualification processes.