About the role
AI summarisedThis internship project focuses on yield improvement through advanced process analysis and wafer edge performance optimization within semiconductor manufacturing. The intern will examine matching behavior between N and W process flows and evaluate wafer edge exclusion performance to reduce yield losses attributed to edge-related effects, contributing directly to improved yield stability and inspection accuracy.
IDMOnsiteFront End
Key Responsibilities
- Analyze inline, defect, and inspection data across modules to uncover root causes of yield variation.
- Evaluate bevel and wafer edge behavior in the context of process mismatch.
- Assess process sensitivity related to N and W complementary metal oxide semiconductor matching.
- Develop analytical methodologies to strengthen yield performance in a production environment.
- Contribute to the development of an improved wafer inspection algorithm that accurately reflects edge exclusion performance.
Requirements
- Strong analytical thinking abilities.
- Familiarity with semiconductor process knowledge.
- Capability in statistical data analysis.
- Proficiency in defectivity interpretation skills.
- Ability to translate complex data findings into actionable engineering insights.
- Relevant coursework in Microelectronics, Electrical Engineering, Chemical Engineering, Materials Science, or Semiconductor Physics.