Qualcomm

Taping Process Engineer

Qualcomm
Fabless SemiconductorSingapore, Central Singapore, SingaporeOnsitePosted 2 weeks ago

About the role

AI summarised

The Taping Process Engineer will support backend wafer level manufacturing operations by leading and sustaining critical processes such as Tape Expansion, UV Curing, and Taping. Responsibilities include hands-on troubleshooting, process optimization, driving continuous improvement, leading cross-functional projects, and ensuring audit readiness. The role requires a bachelor's degree in a relevant engineering field and hands-on experience with production tools and vendor management.

FablessOnsiteHardware Engineering

Key Responsibilities

  • Lead and sustain backend processes including Tape Expansion, UV Curing and Taping
  • Drive continuous improvement initiatives to reduce cycle time, improve yield, and lower operational costs
  • Drive permanent solutions to resolve chronic process and quality issues
  • Lead investigation for process quality escalation
  • Lead process buyoff and performance validation for new machines and technologies
  • Responsible for preparing the line for internal & external audits and follow-up actions
  • Lead cross-functional projects involving technology transfer, cost savings, and process enhancement
  • Coordinate with Technology Development and Process Integration teams for new product release / quality related matters

Requirements

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field
  • Hands-on involvement with production tools
  • Troubleshooting equipment
  • Process optimization
  • Vendor management
  • Sustaining critical processes
  • Resolving production issues
  • Driving continuous improvement