About the role
AI summarisedJoin Micron's world-class global team in Advanced Packaging Technology Development (APTD) to contribute to high-performance memory products, particularly those enabling AI innovations. This role focuses on package health monitoring, simulation, and characterization through hands-on engineering in DFT, data analysis, and reliability testing.
IDMOnsiteHIG
Key Responsibilities
- Develop and implement DFT strategies for advanced packaging.
- Conduct simulations covering mechanical, thermal, and electrical performance of packages.
- Perform electrical and mechanical characterization of advanced packages.
- Analyze test and field data to identify early indicators of package degradation.
- Collaborate with data scientists to build predictive models for package health.
- Support root cause analysis and implement corrective actions for reliability issues.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or a related field.
- 2+ years of experience in the semiconductor industry (complex products preferred).
- Preferable background in packaging, test, or reliability engineering.
- Hands-on experience with simulation tools and test equipment for package characterization or reliability testing.
- Proficiency in statistics, data analysis, and scripting (e.g., Python, MATLAB, JMP).
- Strong understanding of semiconductor packaging processes, material interactions, and properties.
- Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes.