About the role
AI summarisedLead advanced process development for structural and electric thin films in NAND technology, driving technical strategy, problem-solving, and process integration across multi-functional teams.
IDMOnsiteSTPG
Key Responsibilities
- Define technical strategy and lead multi-functional projects in structural and electric film development.
- Architect solutions and promote innovative technologies across teams to influence technical standards.
- Lead advanced process development, fixing, and integration of unit processes into full module packages.
- Drive complex problem solving across process/structure/hardware/device interactions, including root cause analysis and corrective actions.
- Utilize advanced characterization techniques to correlate process parameters to device performance and derive reliability models.
- Lead multi-functional teams and vendor engagements to push hardware/process capability and secure resources.
Requirements
- Advanced proficiency in thin film processing (Plasma Enhanced CVD, Thermal CVD, ALD).
- Hands-on experience with structural and electric film hardware and equipment optimization (dielectric and carbon based films).
- Strong understanding of process-mechanical-device interactions, reliability modeling, and 3D NAND scaling.
- Skilled in advanced characterization techniques (SIMS, XPS, TEM, electrical stress testing).
- Proven ability to lead technical problem-solving and support engineers.
- Experience with hardware optimization including precursor delivery, temperature control, and chamber matching.