About the role
AI summarisedJoin the High Bandwidth Memory (HBM) Product Engineering Media Health team at Micron to drive innovation in reliability testing for cutting-edge HBM products. This role involves developing and executing intrinsic and extrinsic reliability test programs to ensure product quality, cost-efficiency, and cycle time targets are met. You will play a pivotal role in maintaining product robustness through advanced coding and comprehensive testing.
IDMOnsiteHIG
Key Responsibilities
- Develop new reliability test flows (e.g., extended wafer level burn in, pWLRx, ELFR) for both DRAM and Interface die and stacked products.
- Perform intrinsic and extrinsic reliability assessments to meet critical KPIs regarding Quality, Cost, and Cycle Time.
- Conduct root cause analysis and resolution for issues encountered in reliability test programs.
- Promote innovation by developing new reliability features, solutions, or optimizing code infrastructure to maintain a competitive technical edge.
- Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
- Analyze engineering data using in-house statistical tools for product validation and risk assessment.
- Define interface hardware specifications and validate/debug new interface boards for optimal performance.
Requirements
- Strong grasp of engineering principles and advanced problem-solving skills.
- Experience in reliability testing for high-speed memory products (HBM preferred).
- Proficiency in writing and debugging complex test programs.
- Ability to make technical decisions regarding risk analysis and project prioritization.
- Experience with data analysis using statistical tools for product validation.
- Willingness to work on-site in Singapore with international travel to the US, Taiwan, and Japan.