About the role
AI summarisedAs a key talent in the High Bandwidth Memory (HBM) Product Engineering Media Health team, you will be responsible for intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. This role involves developing new reliability test flows to meet critical KPIs in Quality, Cost, and Cycle Time, ensuring product robustness through advanced coding and comprehensive testing.
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Key Responsibilities
- Drive the development of new reliability test flows (e.g., extended wafer level burn in, pWLRx, ELFR) for both DRAM and Interface die.
- Assess product reliability through extrinsic DPM (Time0 and Field DPM) and intrinsic reliability testing.
- Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
- Analyze engineering data using in-house statistical tools for validation and risk assessment.
- Define interface hardware specifications and perform validation/debug of new interface boards.
- Make final technical decisions regarding risk analysis and project prioritization.
- Mentor team members and drive process improvements for cost reduction and quality enhancement.
Requirements
- Bachelor's or Master's degree in Electrical & Electronics Engineering, Computer Science, or related field.
- Strong proficiency in coding/programming languages such as Python or C++.
- Proven experience in reliability engineering or a related technical role.
- Strong problem-solving skills with deep root cause analysis capabilities.
- Basic understanding of CMOS technology and DRAM device physics and design.
- Proficiency in statistics and data analysis tools/scripting.
- Familiarity with testing verification approaches and adherence to testing protocols.