About the role
AI summarisedAs a NAND Module Process Integration Engineer in the Singapore R&D department, you will be responsible for designing, developing, integrating, and implementing innovative process solutions to enhance next-generation 3D NAND Product Yield and Quality while maintaining competitive cost and performance within timelines.
IDMOnsiteSTPG
Key Responsibilities
- Identify and quantify key module deficiencies and technology gaps, leading cross-functional teams to address these issues.
- Improve current process flows and develop innovative solutions to meet product requirements and manufacturability targets.
- Develop or redefine CSPEC criteria necessary for optimal product performance and drive activities to ensure manufacturing process capability.
- Coordinate manufacturing site activities to secure funding for experiments and conversions, communicating decisions clearly to R&D, Product Engineering, and Manufacturing partners.
- Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types, establishing proof of concept for future tech nodes.
- Take a leadership role in quarterly yield summits and monthly program reviews to summarize complex problems, detail actions taken, and align teams.
- Assist in the successful transfer of new technology from R&D to manufacturing, including documentation and training.
Requirements
- Minimal of 2 years of experience in the semiconductor industry.
- BS, MS/PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field.
- Adept at data analysis, problem-solving, and process integration optimization.
- Excellent communication skills with the proven ability to work in cross-functional teams.
- Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
- Self-motivated, self-governing, with a proven ability to work in a demanding and dynamic environment.