About the role
AI summarisedThe TSE Technician supports Test Solutions Engineering (TSE) activities for High Bandwidth Memory (HBM) products at wafer probe. This role executes operational, data, and system-level tasks critical for efficient HBM probe evaluations, production releases, and yield/debug activities across NPI and high-volume manufacturing phases.
IDMOnsiteAssembly & Test
Key Responsibilities
- Support HBM probe activities by executing requests from TSE engineers, including lot assignment, tracking, and coordination of lot handling.
- Manage attribute tagging, traveler setup, and execution of hold/release procedures for probes.
- Support experiments and investigations focused on yield improvement, test time optimization, and probe-related issues.
- Perform data mining and generate reports with basic analysis to support engineering debug, root-cause investigations, and ramp readiness.
- Track and maintain HBM probe execution metrics under TSE engineer direction, such as Lot Turnaround Time (TAT) and execution status.
- Generate regular metric summaries and dashboards using standard or auto-report tools for daily execution reviews.
- Ensure data accuracy, consistency, and traceability across all TSE probe support systems.
- Assist in feeding experiment results back into probe programs under TSE engineer guidance.
- Coordinate with cross-functional teams (Process, Yield, Manufacturing, PI/YE, ME) to ensure smooth HBM probe activity execution.
Requirements
- Ability to execute operational, data, and system-level tasks in a fast-paced HBM development environment.
- Strong attention to detail regarding data discipline and execution tracking.
- Ability to follow technical instructions from TSE engineers during NPI and high-volume manufacturing phases.
- Proficiency in tracking execution metrics like Lot TAT and status updates.
- Experience or aptitude for data mining and report generation to support engineering analysis.