About the role
AI summarisedAs a Principal Engineer in Advanced Package Technology Development, you will lead the innovation of 2.5D and 3D packaging solutions, including High Bandwidth Memory and Hybrid bonding, to drive Micron's strategic technical roadmaps.
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Key Responsibilities
- Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value
- Collaborate continuously with internal and external partners to ensure seamless technology integration
- Consult and influence technical and strategic decisions at senior management levels
- Lead multi-disciplinary technical teams and task forces to achieve strategic goals
- Analyze and understand competitive trends and metrics to improve Micron’s competitive edge
- Guide the development of packaging technology roadmaps and define requirements with proven technical data
- Troubleshoot advanced issues and provide mentorship for resolution
- Innovate continuously through patents, trade secrets, technical presentations, and papers
- Engage in and promote ongoing cost reduction and quality improvement initiatives
Requirements
- Over 5 years of professional experience in semiconductor advanced packaging
- BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field
- Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding
- Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process
- Experience in DRAM manufacturing and OSAT companies
- Understanding of DRAM wafer structure and process flows
- Proficient in English, with additional language skills in East Asian languages preferred
- Evidence of innovation demonstrated by patent inventions or published literature