Micron Technology

Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 6 months ago

About the role

AI summarised

Join the Advanced Packaging Technology Development (APTD) team at Micron to drive innovation in high-performance memory products. This role focuses on developing and enabling cutting-edge inspection and metrology techniques for advanced packaging technologies, playing a crucial role in identifying yield breakthroughs.

IDMOnsiteHIG

Key Responsibilities

  • Develop and optimize metrology recipes for various semiconductor processes, ensuring accuracy and efficiency for production needs.
  • Establish inspection methodologies and best-known methods (BKM) for metrology processes.
  • Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP).
  • Perform in-line characterization and validation of metrology recipes.
  • Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress.
  • Continuously analyze data to identify improvement opportunities and ensure process efficiency.

Requirements

  • Experience in Advanced Packaging Technology Development (APTD) is required.
  • Proven ability to develop innovative inspection and metrology techniques.
  • Strong background in defect analysis and yield improvement strategies.
  • Proficiency in developing and executing process monitoring strategies.
  • Ability to establish robust inspection methodologies.
  • Experience with data analysis and reporting on process performance.