About the role
AI summarisedAs a NAND Module Process Integration Engineer in the Singapore R&D department, you will be responsible for designing, developing, integrating, and implementing innovative process solutions to improve next-generation 3D NAND Product Yield and Quality while maintaining competitive cost and performance within required timelines.
IDMOnsiteSTPG
Key Responsibilities
- Identify and quantify key module deficiencies and technology gaps, leading cross-functional teams to address these issues.
- Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
- Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
- Coordinate manufacturing site activities to secure funding for experiments and conversions, optimally communicating decisions to R&D, Product Engineering, and Manufacturing partners.
- Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types, establishing proof of concept for future tech nodes.
- Take a leadership role in quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken, and align teams.
Requirements
- Passionate about semiconductor technology and innovation.
- Adept at data analysis, problem-solving, and process integration optimization.
- Excellent communication skills and ability to work in cross-functional teams.
- Ability to be self-motivated and self-governing with proven ability to work in a demanding & dynamic environment.