About the role
AI summarisedJoin Micron's Advanced Packaging Technology Development (APTD) team to drive innovation at the forefront of high-performance memory products. This role focuses on developing and enabling advanced packaging technologies to meet stringent requirements for performance, cost, manufacturability, quality, and reliability in the era of AI proliferation.
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Key Responsibilities
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
- Drive product quality improvements, enhance productivity, and reduce costs through integration of semiconductors with process and product engineering teams.
- Achieve and improve yields through silicon package integration innovation, including layout/design or process margin improvements.
- Collect and analyze complex data to provide actionable outcomes for layout, design, or integration flow changes.
- Collaborate with Probe, Yield Analysis, Test, and Product Engineering teams to drive manufacturing improvements.
- Ensure defense coverage through rigorous process, measurement, inspection, and testing protocols.
- Work closely with internal and external stakeholders to execute technology development strategies aligned with business objectives.
Requirements
- B.S./M.S./Ph.D. in Electrical, Mechanical, Chemical Engineering, Physics, Material Science, or related technical fields.
- 2+ years of semiconductor process integration experience.
- Proven ability to develop and enable advanced package technology for post-fab wafer finish and assembly processes.
- Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
- Strong understanding of process flows, interactions, and semiconductor integration partnering with process/product engineering.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Ability to resolve complex issues using root-cause or model-based problem solving.
- Tenacity and proven track record to solve problems effectively under timelines and limited resources.