About the role
AI summarisedEngineering Specialist responsible for the maintenance, troubleshooting, and optimization of semiconductor assembly equipment. The role focuses on ensuring high machine uptime and process stability for die attach and wire bonding modules in a cleanroom environment.
IndustrialOnsiteManufacturing
Key Responsibilities
- Perform preventive and corrective maintenance on assembly equipment including Die Attach and Wire Bonders
- Troubleshoot complex electromechanical issues and restore machines to production specifications
- Analyze equipment performance data to reduce downtime and increase Mean Time Between Failures (MTBF)
- Collaborate with process engineers to optimize machine parameters for new product introductions
- Manage spare parts inventory and coordinate with external vendors for specialized repairs
- Document all maintenance activities and equipment modifications in the site tracking system
- Provide technical guidance and training to junior technicians and production operators
- Support continuous improvement projects to enhance equipment throughput and yield
Requirements
- Diploma or Degree in Mechanical, Electrical, or Mechatronics Engineering
- Minimum 3 years of experience in semiconductor back-end or assembly equipment maintenance
- Proficiency in troubleshooting high-precision automation platforms such as K&S, ASM, or Besi
- Strong ability to read and interpret electrical schematics and mechanical drawings
- Familiarity with Statistical Process Control (SPC) and Failure Mode and Effects Analysis (FMEA)
- Willingness to work in a Class 1000 cleanroom environment
- Ability to work on a rotating shift schedule including weekends if required
- Strong analytical skills for root cause identification using 8D or 5-Why methodologies
- Effective communication skills for technical reporting and team collaboration