Micron Technology

Intern - Process Engineering – Copper Plating Tool Matching & Optimization

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 4 days ago

About the role

AI summarised

This project focuses on the evaluation and optimization of copper plating processes to achieve tool-to-tool consistency and stable manufacturing performance across multiple plating platforms. The intern will apply data-driven methods to study process alignment and manufacturability, gaining structured exposure to the copper plating process flow.

IDMOnsiteFront End

Key Responsibilities

  • Evaluate inline defect data from copper plating processes
  • Correlate process conditions and tool parameters to assess process stability
  • Analyze yield, electrical, and metrology data to understand process variation
  • Conduct exploratory data analysis on plating processes
  • Participate in controlled experiments under technical guidance
  • Apply basic statistical process control concepts to the plating process

Requirements

  • Currently pursuing a Bachelor's degree in Chemical Engineering, Materials Science and Engineering, Mechanical Engineering, or a related engineering discipline
  • Basic understanding of chemical or materials engineering principles
  • Data analysis capability
  • Logical thinking and attention to detail
  • Effective written communication skills
  • Minimum commitment of 3 months