About the role
AI summarisedJoin Micron Technology in the HBM HIG group to drive the development of High Bandwidth Memory solutions for Machine Learning and Artificial Intelligence. As an Engineering Execution Lead/Manager, you will guide an HBM product through its lifecycle phases—concept, design, NPI, and HVM—by facilitating cross-functional execution and providing technical leadership.
IDMOnsiteHIG
Key Responsibilities
- Integrate all aspects of HBM development across extended HIG and TPG teams, including partner organizations.
- Partner with Technology Development, Design, Process, APTD, PE, and Manufacturing teams to drive development progress and alignment.
- Collaborate with PMO organization to build and maintain detailed development schedules from pre-silicon through HVM.
- Provide regular communication regarding development status, priorities, and challenges across the broader organization.
- Set and prioritize tactical expectations for development activities based on defined milestones and stakeholder needs.
- Serve as the product point of contact, identifying owners for tasks and issues while managing development documentation.
- Consolidate inputs required for hardware readiness and capacity planning to support engineering activities.
Requirements
- Bachelor’s or Master’s degree in Electrical or Computer Engineering, or manufacturing/supply chain related fields.
- 5+ years of relevant technical, manufacturing, or experience driving cross-functional teams.
- Excellent verbal and written communication skills for technical and senior management audiences.
- Comfortable with data analysis methods, visualization, and communicating data-backed conclusions.
- Familiarity and capability with JIRA, Confluence, or Project Management software tools.
- Innovative mindset open to process and product improvement.