Micron Technology

ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 1 month ago

About the role

AI summarised

Join the Package Development Engineering Team for Advanced Packaging in Singapore to support next-generation memory and HBM packaging technologies. This individual contributor role focuses on transitioning new products from development through to high-volume manufacturing, partnering globally with development, manufacturing, and supplier teams.

IDMOnsiteAssembly & Test

Key Responsibilities

  • Enable smooth technology transfer from development to high-volume manufacturing.
  • Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
  • Perform risk assessments including Failure Mode & Effect Analysis (FMEA) and implement effective control plans and corrective actions for abnormal conditions.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
  • Contribute to a culture of continuous improvement by identifying, testing, and sharing AI-enablement enhancements within the scope of work.

Requirements

  • Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.
  • Strong analytical, logical, and critical thinking skills.
  • Effective communicator capable of collaborating across all levels.
  • Growth mindset with a passion for continuous learning.
  • Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.
  • Operations support, including shift and weekend coverage, is required.