About the role
AI summarisedThe PDE Pillar Lead provides technical leadership and strategic oversight for advanced packaging initiatives within the Advanced Packaging & Technology Development organization. This role is accountable for driving technology enablement, yield acceleration, and seamless integration of next-generation packaging solutions while establishing governance frameworks and optimizing development workflows.
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Key Responsibilities
- Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.
- Define technical objectives, key deliverables, and resource allocation for pillar initiatives.
- Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.
- Develop and enforce standardized methodologies for technical program management and pillar governance.
- Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems.
- Align pillar objectives with PDE’s mission to embed analytics, simulation, and advanced modeling into development workflows.
- Define and monitor KPIs for technology maturity, yield performance, and EOL accountability.
Requirements
- Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline.
- 8+ years of experience in semiconductor packaging, process integration, or technology development.
- Proven ability to lead complex, cross-functional technical programs in a high-tech environment.
- Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
- Strong technical communication and leadership skills.