Micron Technology

Intern - HIG HBM PACKAGE PSE

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 3 weeks ago

About the role

AI summarised

Join the Heterogeneous Integration Group High Bandwidth Memory Product System Engineer team to contribute to setting up an HBM defect library and creating a standardized tracking dashboard for defect fail modes.

IDMOnsiteHIG

Key Responsibilities

  • Understand the electrical failing signature(s) of different defect fail modes across the process.
  • Analyze how defects manifest in each test flow.
  • Document defect fail modes for the HBM defect library.
  • Develop a user-friendly dashboard to track and document all defect fail modes.

Requirements

  • Basic knowledge of semiconductor/physics.
  • Proficiency in Python coding.
  • Pursuing an advanced degree (MSc) in a relevant field.
  • Commitment to a minimum duration of 6 months.