About the role
AI summarisedJoin Micron Technology to work on groundbreaking 3D NAND technology as a Principal/Staff Engineer. This role involves leading process modules, defining structural specifications, driving innovation from research to high-volume manufacturing, and solving complex technical challenges in data storage solutions.
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Key Responsibilities
- Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits.
- Define structural specifications and process requirements for assigned modules.
- Set a clear direction and vision for the module and establish a continual improvement plan.
- Identify potential structure, electrical, and reliability issues early and address them with process control using a model-based approach.
- Focus on structural development, electrical performance, parametric verification, and process control to optimize manufacturability.
- Analyze materials physically and electrically, collaborating with process groups to transition new materials from research to production.
- Build and complete device and process experiments, extracting, analyzing, and reporting conclusions on data.
- Assemble and coordinate a development team, including process engineers, to drive module development.
- Innovate to address complex problems and regularly submit patent disclosures.
- Coordinate activities across cross-functional teams to enable rapid project progression and support technology transfer from R&D to high-volume manufacturing.
Requirements
- Masters/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science, or a related field, or equivalent experience.
- Minimum of 5 years of experience in Wafer Fabrication Process Development in Dry Etch, Photolithography, Films, Wet Process, CMP or Process Integration.
- Strong complete understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
- In-depth knowledge and direct experience with non-volatile memories (NAND) including process flow, process/device interaction, and common yield & reliability issues.
- Proven experience in R&D and technology transfer to manufacturing.
- Adept at data analysis, problem-solving, and process integration optimization.
- Excellent communication skills and capacity to collaborate within cross-functional teams.