About the role
AI summarisedJoin Micron Technology to drive innovation in memory and storage solutions by developing, optimizing, and maintaining advanced dry etch equipment for next-generation 3D NAND nodes.
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Key Responsibilities
- Set up equipment and/or CIP hardware for evaluation by the process development team to support early introduction, maturity, and adoption of 3D NAND nodes.
- Collaborate with Fab layout and facility teams to ensure flawless installation and operation of equipment.
- Develop and optimize existing equipment hardware to meet the efficiency requirements of advanced 3D NAND parts.
- Translate future technology needs into clear equipment development requirements by engaging with peers on upcoming nodes.
- Build and implement advanced equipment monitoring and control methodologies.
- Lead teams or suppliers on complex projects to mature equipment technology for technical advantage, cost, and efficiency.
- Serve as a technical expert within Micron, advising senior management on equipment development improvements and leading innovation projects.
Requirements
- Bachelor’s or Master’s Degree in Mechanical, Chemical, Electrical/Electronic, or Material Science with no less than 3 years of relevant experience, OR a PhD in a related field.
- In-depth understanding of dry etch equipment operation, working principles, troubleshooting, and tool installation procedures.
- Proven ability to prioritize and manage multiple projects simultaneously while efficiently applying resources.
- Remarkable oral and written communication skills for global technical expression.
- Ability to identify and resolve safety hazards while strictly following procedures (lockout, chemical safety, lifting techniques).
- Maintain and publish roadmaps defining work/CIPs needed to advance toolsets through EMI levels toward HVM transfer.