About the role
AI summarisedJoin the High Bandwidth Memory (HBM) Product Engineering Media Health team at Micron. In this pivotal role, you will be responsible for intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products, driving innovations to meet critical KPIs in Quality, Cost, and Cycle Time. You will ensure product reliability through advanced coding practices and comprehensive testing while collaborating across global functions.
IDMOnsiteHIG
Key Responsibilities
- Develop new reliability test flows (e.g., extended wafer level burn in, pWLRx, ELFR) for both DRAM and Interface die and stacked products.
- Perform intrinsic and extrinsic reliability assessment to meet critical Quality, Cost, and Cycle Time KPIs.
- Conduct root cause analysis and resolution for reliability test program related issues.
- Drive innovation by developing new reliability features, solutions, or optimizing code infrastructure to maintain competitive edge.
- Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
- Analyze engineering data using in-house statistical tools for validation and risk assessment.
- Define interface hardware specifications and validate/debug new interface boards.
- Make technical decisions regarding risk analysis and project prioritization.
Requirements
- Strong grasp of engineering principles and advanced problem-solving skills.
- Experience in reliability test program coding for high-performance memory products is essential.
- Ability to work on-site in Singapore with international travel to the US, Taiwan, and Japan.
- Dedication to maintaining high-quality standards in product development.
- Experience with reliability testing methodologies (e.g., burn-in, aging tests).
- Proven ability to collaborate effectively in cross-functional engineering environments.