About the role
AI summarisedJoin the revolutionary next-generation NAND research & development dry etch team. This role involves driving critical modules for advanced NAND by developing, optimizing, and scaling state-of-the-art dry etch processes in close collaboration with various process integration teams.
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Key Responsibilities
- Develop dry etch processes to meet the physical and electrical requirements of Micron’s products.
- Optimize dry etch processes to reduce cost, process variability, and improve process capability.
- Collaborate with process integration and other process development teams to develop innovative new solutions.
- Conduct root cause and failure mode analysis to understand hardware limitations and drive vendor solutions.
- Perform fundamental research to drive innovative solutions for next-generation products.
- Maintain a technology development pilot manufacturing line.
- Support process transfer to production facilities (domestic and/or international travel may be required).
Requirements
- Masters degree with a minimum of 2 years of relevant experience involving dry etch in the semiconductor industry OR PhD in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, or Semiconductor engineering.
- Bachelors degree in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, or Semiconductor engineering with a minimum of 5 years of relevant experience in dry etch process.
- Demonstrated aptitude in research and development within science and engineering fields.
- Strong analytical and creative problem-solving skills to resolve complex issues through root-cause or model-based approaches.
- Fundamental knowledge of at least one of the following: transport phenomena, dry etch processing, kinetic theory, statistical thermodynamics, or plasma physics.
- Ability to work independently with minimal direction and maintain a focus on commitments.