About the role
AI summarisedJoin Micron Technology, a global leader in memory and storage solutions, to drive relentless innovation in advanced packaging wafer level technology. This role involves establishing and improving critical process conditions, enhancing equipment capabilities, ensuring quality through rigorous testing, and collaborating across diverse engineering teams to bring next-generation products from development to high-volume manufacturing.
IDMOnsiteHIG
Key Responsibilities
- Establish and improve Wafer level process conditions and technologies, including wafer thinning and backside metal interconnect.
- Upgrade process capabilities and actively work to reduce production costs.
- Establish and improve process management projects to meet technology node requirements and scaling targets for next nodes.
- Evaluate and promote new equipment and materials to enhance overall process capabilities.
- Set up precise process parameters for various semiconductor equipment.
- Ensure defense coverage through comprehensive process, measurement, inspection, and testing protocols.
- Collaborate with internal and external partners across teams (Package Integration, Assembly Engineering, Front End Wafer Fab, etc.) to integrate manufacturing processes for optimal performance.
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to High Volume Manufacturing facilities.
Requirements
- Bachelor’s or advanced degree in Engineering or Science is required.
- Strong analytical, logical, and critical thinking skills are essential.
- Effective communicator capable of collaborating across all organizational levels.
- Demonstrated growth mindset with a passion for continuous learning.
- Interest in and knowledge of the semiconductor industry is preferred.
- Ability to work closely with internal and external partners on technology development strategies.