About the role

AI summarised

The Staff Packaging Engineer at AMD leads the industrialization of advanced packaging technologies from NPI through HVM, working with OSAT partners across multiple countries to ensure manufacturing readiness, yield, quality, and delivery. The role involves driving DFM integration, managing external supplier performance, leading cross-functional investigations for yield and quality issues, and executing structured methodologies like DOE, SPC, FMEA, and 8D to drive continuous improvement. Based in Singapore, this position requires strong technical expertise in advanced packaging, global collaboration skills, and fluency in English, Mandarin, and Korean.

FablessOnsiteEngineering

Key Responsibilities

Lead end-to-end industrialization of advanced package technologies from NPI through HVM readiness across external assembly/test manufacturing partners and foundry partners
Primary interface between package design/technology development and external manufacturing partners to ensure manufacturable architecture and clear DFM requirements
Identify/close manufacturability gaps early; drive technology-to-manufacturing transfer and best-practice deployment
Partner with outsourced manufacturing sites to ensure manufacturing capability, capacity readiness, and process maturity for advanced packaging platforms
Drive yield, cycle time, quality, and delivery performance; lead defect reduction and yield improvement with site teams
Manage out-of-control lot disposition; implement CAPA and share BKM
Lead technical reviews, audits, ramp readiness assessments, and coordinated change management with internal/external stakeholders
Drive process control and continuous improvement using DOE/SPC/FMEA and data-driven root cause analysis
Lead cross-functional investigations for yield excursions, reliability risks, and field quality issues, ensuring timely containment and corrective actions (8D)

Requirements

Experience in semiconductor packaging/assembly manufacturing or product engineering, with strong on-site execution in high-volume environments
Proven NPI and ramp leadership, including supplier management, process qualification, manufacturing readiness, and yield ramp monitoring
Demonstrated ability to work effectively with OSAT manufacturing operations in multiple countries, including structured communication, escalation management, and fast-turn coordination across site teams and global stakeholders
Demonstrated success in yield improvement/defect reduction, root-cause closure, and disciplined change management in HVM
Hands-on advanced packaging experience (e.g., 2.5D interposer, fan-out, 3D, high-density flip-chip; plus RDL/TCB/hybrid bonding familiarity) with OSAT/factory interface experience
Strong problem-solving and analytics using structured methods (DOE/SPC/FMEA/8D) and manufacturing data to drive decisions
Strong stakeholder management across cross-functional teams and external partners; able to translate issues into clear action plans and drive closure
Professional fluency in English, Mandarin, and Korean to support technical documentation, stakeholder communication, and cross-site engineering collaboration across APAC
Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related engineering discipline