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AMD

Senior Manager, Product Development Eng. (System Level Test)

AMD
Fabless SemiconductorSingapore, SingaporeOnsitePosted 3 days ago
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About the role

AI summarised

This Senior Manager role leads the New Product Introduction (NPI) System Level Test (SLT) engineering team for high-performance computing products. The position focuses on developing SLT solutions that balance test quality, yield, and cost for next-generation AI and data center hardware. The leader will oversee global team growth and technical strategy while collaborating with architecture, design, and software teams.

FablessOnsiteEngineering

Key Responsibilities

  • Accountable to drive and develop SLT solutions to meet business milestones, cost and quality in system level scope
  • Solves complex, novel, and non-recurring problems; initiate significant changes to existing processes/methods and leads development and implementation
  • Conduct engineering evaluations and analysis to drive closure of production issues
  • Develop and architect SLT logging or data collection flow in manufacturing
  • Influences technical decisions that have a significant impact on final product
  • Involves collaboration on or assuming the consultative or leadership responsibilities for a specific project or for product development initiatives
  • Provide technical supervision or mentoring junior engineers
  • Upscale overall team capabilities on low level system debug for AMD data center product families

Requirements

  • Bachelor/Master in Electrical Engineering, Computer Engineering, or comparable disciplines
  • Proficient understanding of x86 CPU and GPU architecture and functionality
  • Broad understanding of various industry standard bus protocols, such as DDR, PCIe, and USB
  • Knowledge or working experience on GPU architecture, X86 architecture, SoC design and power management features
  • Experience with SOC (System-On-Chip), Firmware and Software interaction
  • Software programming and scripting proficiency (Java, Shell script, Perl, Ruby, Python)
  • Proficiency in Windows and Linux operating systems
  • Experience with HBM (High Bandwidth Memory) and/or HSIO (High Speed Input Output) and/or Co-Packaged Optics is a strong plus
  • Experience with HVM (High Volume Manufacturing) is a strong plus
  • Strong and effective presentation, written and verbal communication skills
  • Ability to work with geographically distributed product engineering teams
  • Excellent interpersonal, organizational, and analytical skills
  • Demonstrating the characteristics of an independent and resourceful individual