About the role
AI summarisedContribute to cutting-edge research within Micron’s Technology Development (TD) organization, focusing on advancing three-dimensional (3D) Electron Tomography techniques for nanoscale structural and compositional characterization of emerging memory technologies using state-of-the-art TEMs and FIB systems.
IDMOnsiteSTPG
Key Responsibilities
- Collaborate with process engineers, integration teams, and TEM specialists to develop innovative TEM characterization workflows.
- Execute 3D Electron Tomography experiments using TEM/STEM/EFTEM.
- Acquire, reconstruct, and interpret tilt-series data into 3D tomographic models.
- Document technical findings and present research results in professional engineering settings.
Requirements
- Currently pursuing a PhD in Materials Science and Engineering, Applied Physics, or a related discipline.
- Basic understanding of semiconductor device physics and materials characterization.
- Hands-on experience with TEM systems (e.g., Nion, TFS, JEOL).
- Familiarity with data analysis tools such as DigitalMicrograph, MATLAB, or Python.
- Strong analytical and problem-solving skills with demonstrated innovation.