About the role
AI summarisedThe Poly Etch Process Engineer provides technical ownership and engineering support for wafer fabrication, focusing on trench etch processes. This role involves real-time problem analysis, SPC/FDC control, and collaborative yield improvement to meet manufacturing targets.
IDMOnsiteProcess Engineering
Key Responsibilities
- Manage a cost-effective wafer fabrication process by providing engineering support to the production line
- Maintain day-to-day manufacturing activities through real-time problem analysis and timely implementation of solutions
- Ensure smooth process flow with high quality, high yield, and low cost by collaborating with maintenance and production teams
- Provide cross-functional and cross-fab support based on operational needs and priorities
- Take full responsibility for trench etch processes within the poly team including profile control
- Set up process recipes for newly introduced processes
- Establish a robust process control system to minimize Wafer at Risk (WAR) levels and maximize signal-to-noise ratios for SPC and FDC
Requirements
- Bachelor’s degree in Electrical/Electronics, Mechanical, Materials, or Chemical Engineering
- Around 2 years of experience specifically with trench etch processes and associated challenges
- Proven ability to conduct real-time problem analysis for SPC OOC/OOS, defect failures, and FDC failures
- Capability to determine and implement technical solutions with relevant stakeholders
- Experience reporting inline investigations with complete and accurate details in real time
- Ability to develop and maintain robust process control systems to minimize human dependency
- Willingness to support shift operations as needed