About the role
AI summarisedJoin SSMC, a Joint Venture between NXP and TSMC, in our Thin Film, PVD Equipment Engineering Department. You will support PVD equipment engineering activities to achieve operational targets and contribute to continuous improvement in cost, yield, productivity, and uptime within a state-of-the-art semiconductor fabrication environment.
FoundryOnsiteEquipment Eng.
Key Responsibilities
- Support PVD equipment engineering activities to meet operational targets and company objectives.
- Drive Continuous Improvement initiatives focusing on Cost, Yield, Productivity, and Uptime.
- Manage ownership for equipment uptime, wafer scrap reduction, parts management, and minimizing Equipment Down Memos.
- Troubleshoot and resolve complex equipment issues to support daily production runs.
- Review and optimize existing equipment maintenance procedures and manage consumables/spare parts inventory.
- Participate in technology transfer from motherfab and implement TSMC/NXP BKMs while generating SSMC BKMs.
- Update Operating Instructions (OIs) and Standard Operating Procedures (SOPs) to document best practices.
- Plan Preventive Maintenance schedules in alignment with Manufacturing needs.
Requirements
- Bachelor's Degree or higher in Mechanical, Mechatronics, Electrical, or Electronics Engineering.
- 1-3 years of experience in a semiconductor manufacturing environment (Fresh graduates welcome with keen interest).
- Ability to perform weekend 12-hour shifts, Swing Shifts, or any shift pattern as defined by the Manager.
- Strong problem-solving skills and attention to detail.
- Proficiency in Microsoft Office applications.
- Ability to work effectively in a multi-cultural environment.