About the role
AI summarisedJoin Micron Technology to drive innovation in advanced packaging equipment. This role involves developing, optimizing, and managing cutting-edge wafer and assembly equipment to meet stringent technology node requirements while collaborating across diverse engineering teams.
IDMOnsiteHIG
Key Responsibilities
- Develop and optimize advanced packaging equipment, including wafer-level packaging and stacking technologies.
- Develop wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products.
- Lead cross-functional teams (Package Integration, Front End Wafer Fab, Assembly/Test Engineering, etc.) to integrate manufacturing processes for optimal performance.
- Ensure defense coverage through rigorous process, measurement, inspection, and testing protocols.
- Conduct continuous data analysis to establish advanced controls and identify critical improvement opportunities.
- Collaborate with process development teams to develop innovative solutions for next-generation equipment products.
Requirements
- B.S./M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical fields.
- 5+ years of semiconductor process or equipment engineering experience.
- Demonstrated experience in wafer bonding, plating, warpage control, or packaging/stacking process equipment.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Experience in equipment development with a fundamental understanding to improve maturity for First of a Kind (FOAK) hardware.
- Proven track record in problem-solving and addressing root causes.