Jobfoundry
Jobfoundry
Micron Technology

Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 4 weeks ago
Apply Now

About the role

AI summarised

Join the High Bandwidth Memory (HBM) Package Product Engineering team within the Heterogeneous Integration Group at Micron Technology. You will be part of a global, high-performing team driving Package and HBM Product engineering activities focused on critical KPIs: Quality, Cost, Cycle Time, and Scale. This role involves deep technical problem-solving across manufacturing flows to ensure the successful development and shipment of next-generation HBM products.

IDMOnsiteHIG

Key Responsibilities

  • Improve assembly coverage within manufacturing flows to enhance Time 0 and Field DPM and prevent inline fallout.
  • Improve HBM Cube yield through test optimization and coverage by collaborating with Technology Development and Packaging organizations.
  • Debug and identify root causes of failures in Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) for Quality and RMA packaging issues, driving resolutions through cross-functional collaboration.
  • Establish robust Process Conversion Business Processes with FAB, Technology Development, and Advanced Packaging teams to facilitate Yield Improvement and DPM improvement.
  • Provide recommendations for new process conversions to reduce cost and increase yields of HBM products.
  • Collaborate with cross-functional teams (Fab, HBM Technology Development, HBM Design, System Development, Quality/Reliability) to ensure holistic product development.
  • Promote innovation and drive technical changes that maintain the company's competitive market edge.
  • Serve as an AI/ML Advocate by collaborating on models to enhance KPIs such as Quality, Cost, Cycle Time, and Scale.

Requirements

  • Bachelor's/Master's degree in Electrical, Electronic, or Mechanical Engineering.
  • More than 3 years of experience in the semiconductor industry.
  • Demonstrated competent technical skills, especially in problem-solving with root cause understanding.
  • Proven ability to develop and implement solutions through in-depth circuit analysis.
  • Product Engineering and Packaging Experience is preferred.