Jobfoundry
Jobfoundry
Micron Technology

Package Development Engineering – Product Integration Engineer (PDE PIE)

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 2 weeks ago
Apply Now

About the role

AI summarised

Serve as a key technical contact point for the Technical Program Manager on product matters, applying engineering knowledge to advanced package assembly flows and New Product Introduction (NPI) qualification.

IDMOnsite

Key Responsibilities

  • Act as the point of contact for the Technical Program Manager regarding product-related matters.
  • Address issues related to die stacking, thin substrates, mold compound, warpage, and mechanical reliability.
  • Conduct process characterization and validation activities.

Requirements

  • Bachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor, or related Engineering discipline.
  • Strong understanding of NPI qualification frameworks (Qual, Low Volume Manufacturing, Post Release Qualification).
  • Familiarity with Phase Gate / NPI / Technology Development (TD) business processes.
  • Ability to demonstrate strong ownership mindset and lead without direct authority.
  • Strong analytical, logical, and critical thinking skills.
  • Effective communication skills to collaborate across all organizational levels.