About the role
AI summarisedJoin the Etching, Process Eng. III Department at SSMC, a Joint Venture between NXP and TSMC. We are seeking an innovative engineer to develop, sustain, and optimize Etch Process Capability to meet operational goals in a state-of-the-art semiconductor fabrication environment.
FoundryOnsiteProcess Eng.
Key Responsibilities
- Develop, sustain, and optimize Process Capability to meet operational goals with a quality mindset.
- Responsible for new Process Development and/or Process Transfer and optimization for Yield and Productivity improvement.
- Troubleshoot and resolve process-related issues efficiently.
- Sustain and improve Process Capability, CpK.
- Qualify and release tools for required Manufacturing capacity.
- Qualify alternate sources for Cost improvement Plan and execute Engineering Projects.
- Drive continuous improvement through participation in 10k idea, LSS & BKM to create cost-effective processes.
- Setup, monitor, and maintain SPC charts.
- Adhere to and complete all necessary documentation.
Requirements
- Bachelor’s degree in engineering / science or equivalent.
- At least 3 years relevant experience in Semiconductor manufacturing environment (Fresh graduates welcome, training provided).
- Basic engineering knowledge including semiconductor devices theory, electronics, digital principle, and wafer fabrication processes.
- Good problem-solving skills.
- Strong sense of responsibility and positive learning attitude.
- Detail-oriented with the ability to perform under time constraints.
- Good communication and presentation skills.