About the role
AI summarisedLead a talented team in the capacity of Manager for NAND Design Rule/Process Integration, supporting both development and large-scale production of advanced 3D NAND technologies. This role is critical for ensuring high quality, accurate design-rule and PDK results, and maintaining strict documentation across R&D and production efforts.
IDMOnsiteSTPG
Key Responsibilities
- Lead the release of design rules and PDK deliverables, coordinating DRC waivers, mask definitions, and mask reviews for R&D and production.
- Own program execution from kickoff through end-of-life for assigned projects.
- Partner cross-functionally with Array & CMOS Process Integration, Devices, Layout & Build, Modeling, Scribe & Frame, and Quality & Reliability to guide new 3D NAND generations.
- Ensure high quality and documentation for Build Rule Checks (DRCs) and drive timely disposition of deviations and exceptions.
- Collaborate with Yield Improvement, Product Engineering, Defect Analysis, and Quality Assurance to address layout- or database-related process issues.
- Build and evaluate test structures to generate data for next-generation devices and assess process margin on current technologies.
- Synthesize complex technical problems, clearly communicating status, risks, and resolutions across functions and management levels.
- Define and track sub-milestones within PDK/DBR/TO schedules, ensuring targets are met through cross-team coordination.
Requirements
- PhD in Electrical Engineering, Microelectronics, Physics, or Semiconductor Materials Science with 5+ years of relevant experience; OR Master’s degree with 8+ years; OR Bachelor’s degree with 13+ years in the semiconductor industry.
- Direct experience working with PDK, design rules, and layout, including small layout assignments.
- Proficiency in CAD software such as Cadence Virtuoso, K2View, and Mentor Graphics DRC/RVE or their equivalents.
- Solid understanding of semiconductor device physics and VLSI silicon processing and integration flow.
- Understanding of 3D NAND process flow and major NAND components (e.g., bit-line sensing, word-line driver, data path, and analog circuits).
- Demonstrated ability to resolve complex issues and communicate clearly under pressure.
- Familiarity with CAD group interactions, data post-processing, and data transfer from built databases to reticles.
