About the role
AI summarisedJoin an inclusive team dedicated to relentless innovation in memory and storage solutions. This role drives end-to-end front-end process integration, leading complex root cause analyses and technical decision-making to support yield ramp and product transitions.
IDMOnsiteFront End
Key Responsibilities
- Drive end-to-end front-end process integration across multiple modules to support yield, functionality, and scalability
- Lead cross-module root cause analysis for complex yield detractors and integration issues
- Support yield ramp, derivative matching, and node transitions through focused integration execution
- Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams
- Develop and apply Best Known Methods (BKM) within owned integration scope
- Provide technical input to POR/TOR and ECN decisions affecting integration margin
- Apply data-driven analysis to quantify process sensitivity, margin, and risk
- Participate in SWAT teams and technical deep dives for high-impact issues
- Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline
- At least 3 years of strong front-end semiconductor manufacturing experience with demonstrated exposure to process integration across multiple modules
- Proven ability to perform complex root-cause analysis on yield, functionality, or integration issues using data-driven methods
- Solid understanding of device–process interactions and system-level integration trade-offs
- Experience collaborating across PI, PE, Device, Yield, TD, and Quality organizations
- Ability to influence technical decisions through analysis, insight, and technical credibility
- Strong written and verbal communication skills for technical reviews, deep dives, and cross-team alignment