About the role
AI summarisedMicron MSB is seeking a passionate and driven intern to join the Assembly Process Engineering team. This role offers hands-on exposure to advanced semiconductor packaging processes, focusing on Flip Chip Attach and Underfill technologies. The intern will contribute to process development, yield improvement, and data-driven decision-making projects.
IDMOnsiteAssembly & Test
Key Responsibilities
- Setup, execute, and analyze Flip Chip Attach and Underfill process experiments.
- Collaborate with cross-functional teams to troubleshoot and resolve process issues.
- Apply statistical methods to analyze process data and identify trends or anomalies.
- Explore AI-based approaches for predictive modeling and process optimization.
- Deliver a final presentation summarizing key learnings, challenges, and recommendations.
- Contribute to yield improvement or defect reduction initiatives.
- Develop a simple AI model or script to support process monitoring or defect prediction.
Requirements
- Degree in Mechanical/Chemical/Material Science Engineering.
- Internship availability from January to May 2026.