About the role
AI summarisedThe Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.
IDMOnsiteHIG
Key Responsibilities
- Define quantitative package health metrics and develop detection mechanisms for continuous health assessment.
- Perform electrical and mechanical characterization of packages.
- Implement real-time defect detection and classification, conducting next-level characterization for critical defects.
- Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes.
- Collaborate with process and equipment engineers to establish end-to-end traceability across wafer, assembly, and test stages.
- Develop data pipelines and tools for linking process parameters, equipment signals, and defect signatures.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
- 3+ years of experience in the semiconductor industry (complex products preferred).
- Experience preferably in packaging, test, or reliability engineering.
- Strong understanding of semiconductor packaging process, material interaction, and properties.
- Strong data analytics and statistical modeling skills.
- Ability to work cross-functionally with process, equipment, and reliability teams.