About the role
AI summarisedJoin the Advanced Package Technology Development team at Micron as a Principal Engineer, influencing cutting-edge solutions that drive company goals and revenue. This role involves leading technical innovation in advanced packaging technologies to maintain Micron's competitive edge in the memory industry.
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Key Responsibilities
- Deliver high-value, differentiated technology solutions by driving technical innovation and identifying business opportunities.
- Collaborate with internal and external partners to ensure seamless technology integration across projects.
- Consult on and influence technical and strategic decisions at senior management levels.
- Lead multi-disciplinary technical teams and task forces to achieve strategic goals.
- Guide the development of packaging technology roadmaps based on competitive analysis.
- Troubleshoot advanced technical issues and mentor team members toward resolution.
- Innovate continuously through patents, trade secrets, technical presentations, and papers to drive quality improvements.
Requirements
- Over 5 years of professional experience in semiconductor advanced packaging.
- BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field.
- Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding.
- Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.
- Experience within DRAM manufacturing and OSAT companies.
- Proficiency in English.