About the role
AI summarisedJoin Micron's Advanced Packaging Technology Development (APTD) team to drive innovation in high-performance memory products. This role focuses on developing and enabling advanced packaging technologies crucial for the proliferation of AI and high-bandwidth memory (HBM) solutions, ensuring performance, cost, manufacturability, quality, and reliability targets are met.
IDMOnsiteHIG
Key Responsibilities
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity through integration.
- Achieve and improve yields through silicon package integration innovation, including layout/design or process margin improvements.
- Collect and analyze data to provide actionable outcomes and decisions regarding layout, design, or integration flow changes.
- Collaborate with Probe, Yield Analysis, Test, and Product Engineering teams to drive process improvements.
- Ensure defense coverage through rigorous process, measurement, inspection, and testing protocols.
- Establish correlations between defense mechanisms to identify opportunities for enhancement.
Requirements
- Proven ability to develop and enable advanced packaging technologies.
- Experience in silicon package integration.
- Strong analytical skills to collect and interpret complex manufacturing data.
- Ability to collaborate cross-functionally with process, product, and engineering teams.
- Commitment to achieving high yields in advanced packaging environments.
- Understanding of manufacturing constraints related to performance and cost targets.