About the role
AI summarisedJoin Micron's groundbreaking Next Generation NAND research and development Dry Etch team as a Member of Technical Staff (MTS). You will lead critical modules, drive innovation in dry etch processes, and collaborate across multi-functional teams to achieve program and yield goals for next-generation NAND products.
IDMOnsite
Key Responsibilities
- Lead the development of Dry Etch technology and essential modules for Next Generation NAND.
- Develop and innovate dry etch processes to meet stringent structural and electrical specifications.
- Collaborate with hardware teams to define the equipment roadmap for current and upcoming NAND products.
- Lead multi-functional teams to solve complex structural problems encountered during development.
- Present process and technology development plans for current and upcoming technology nodes.
- Proactively predict future technical issues and build mitigation strategies.
- Mentor less-experienced engineers and contribute to the Technical Leadership Program.
Requirements
- 6-10 years’ experience in dry etch process development, transitioning from R&D into manufacturing.
- 4-5 years of pertinent experience in NAND, DRAM, or Logic module development involving multi-functional groups.
- Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena gained through experience or coursework.
- Demonstrated leadership in problem-solving and experience managing technical projects.
- Understanding of various types of plasma dry etch reactors (e.g., RF sources, chemistries).
- Expertise in statistical process control and analysis.
- Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches with advanced pulsing schemes.