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Micron Technology

ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 1 month ago
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About the role

AI summarised

As an Engineer, Package–Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will begin your career as a technical contributor supporting NAND package and silicon integration for next‑generation memory products. This role offers structured exposure to semiconductor packaging, integration risks, and cross‑functional collaboration within a high‑volume manufacturing environment while operating with close guidance and mentoring.

IDMOnsiteAssembly & Test

Key Responsibilities

  • Support chip‑package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance.
  • Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics.
  • Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items.
  • Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations.
  • Support execution of test vehicles and DOEs, including data collection, basic analysis, and report preparation.
  • Learn Micron’s package and silicon development flows, design rules, and change‑management processes.

Requirements

  • Bachelor’s or Master’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline).
  • Less than 2 years of relevant experience (including internships, co‑op programs, or research) in semiconductor, materials, or manufacturing fields.
  • Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level).
  • Exposure to structured problem‑solving methods (FMEA, DOE, data analysis) through academics or internships.
  • Ability to follow defined engineering procedures and analyze straightforward technical problems.
  • Strong attention to detail and willingness to learn new tools, processes, and technologies.
  • Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation.
  • Good written and verbal communication skills with the ability to collaborate effectively in a team environment.