About the role
AI summarisedAs part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solutions and ensuring the success of New Process, New Equipment, New Material, and Path finding activities for all advanced package products at Micron. This role drives process readiness, yield improvement, and reliability through deep technical understanding across frontend processes, packaging requirements, and chip-package interaction.
IDMOnsiteHIG
Key Responsibilities
- Develop and qualify new packaging process, material, equipment, and technology solutions to meet advanced Technode requirements and schedules.
- Execute CPI NUDD, process TRA, risk mitigation, and ensure process recipe readiness prior to Silicon arrival for a first-pass rate.
- Identify pathfinding opportunities to maintain Micron's technology leadership regarding time-to-market, yield improvement, cost efficiency, and touchpoint optimizations.
- Understand future packaging trends and collaborate with teams to establish new capabilities that enhance overall process performance.
- Define, develop, and establish process capabilities, strategy, and roadmaps for advanced packaging.
Requirements
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience.
- 6 years' and/or above experience in the semiconductor industry.
- Experience in Frontend fab Process integration or Module process.
- Experience in Backend advance packaging wafer/die level process or integration.
- Understanding of silicon integration and its interaction with backend processes at the package level through CPI.
- Proficiency with simulation tools and data analytics platforms for performance analysis and optimization.
- Strong project management skills to ensure execution adheres to timelines.
- Ability to integrate and cooperate effectively with cross-functional teams.