About the role
AI summarisedJoin our inclusive team at Micron Technology to drive Packaging Product yield, quality improvement, and New Product Introduction (NPI) by applying technical expertise in Front End Central Product Integration. You will work with the global Micron network to integrate solutions, standardize processes, and benchmark intelligence to achieve high value bits and productivity.
IDMOnsiteFront End
Key Responsibilities
- Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution.
- Lead the PI Loop taskforce or team to address yield and quality challenges, optimizing process flow to achieve BIC yield performance.
- Give effective presentations on project updates and new initiative proposals to small and large groups.
- Travel to Micron Fab locations as necessary for face-to-face collaboration.
Requirements
- Bachelor’s or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering, or a related field.
- A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration.
- Knowledge of Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, and parametric/electrical test and probe yield.
- Strong data analysis, troubleshooting, problem-solving, reporting, and presentation skills with high attention to detail.
- Good multi-tasking, verbal, and written communication skills.
- Strong interpersonal skills and ability to build positive relationships with colleagues.
- Ability to work effectively with minimal supervision and demonstrate strong organizational capabilities.