About the role
AI summarisedJoin an inclusive team at Micron Technology, a leader in memory and storage solutions. This role is pivotal in the relentless pursuit of innovation for our next-generation HBM products, focusing on optimizing test coverage, driving yield improvement, and ensuring product reliability through deep technical contributions.
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Key Responsibilities
- Ensure optimized test coverage on all current and future HIG HBM design architectures and process nodes for high-volume manufacturing.
- Develop, validate, characterize, and qualify Micron’s next-generation HBM products to meet necessary market standards.
- Provide design verification and in-depth circuit support for new products using CAD tools and Verilog simulations.
- Improve manufacturing test yields (specifically related to Device Issues from DRAM, Interface, and Stacked Die Yield) and reduce test time.
- Promote innovation by driving technical changes that provide a competitive advantage to Micron.
- Mentor and develop team members while contributing to project management and technical decision-making regarding risk analysis and prioritization.
- Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
Requirements
- Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
- Solid understanding of problem-solving methodologies, including root cause identification and solution exploration.
- Familiarity with CMOS technology, DRAM architecture, and basic device physics.
- Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
- Strong attention to detail and a commitment to quality in all tasks.
- Ability to work effectively in team-based projects toward shared goals.
- Clear and effective communication skills, especially when articulating complex technical concepts.