About the role
AI summarisedJoin Micron Technology, a global leader in memory and storage solutions, to drive innovation in advanced packaging equipment. This role involves developing, optimizing, and strategizing on cutting-edge wafer-level packaging and stacking technologies to meet rigorous product requirements.
IDMOnsiteHIG
Key Responsibilities
- Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking.
- Improve equipment capability, enable process enhancements, reduce costs, and enhance productivity through engineering projects.
- Develop wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products.
- Ensure defense coverage through rigorous process, measurement, inspection, and testing protocols.
- Conduct continuous data analysis to establish advanced controls and identify process improvement opportunities.
- Collaborate with internal and external partners across various teams (Package Integration, Front End Wafer Fab, etc.) to integrate manufacturing processes for optimal performance.
Requirements
- Bachelor’s or advanced degree in Engineering or Science is required.
- Strong analytical, logical, and critical thinking skills.
- Effective communicator capable of collaborating across all organizational levels.
- Growth mindset with a passion for continuous learning.
- Interest in and knowledge of the semiconductor industry is preferred.
- Demonstrated leadership and a track record of impact are highly desirable.