About the role
AI summarisedAs a Senior Metrology Development Engineer in the Singapore TD department, you will be responsible for the rapid deployment of innovative 3D NAND process technologies. This role drives development efforts prior to device ramp, defining and executing effective actions needed to achieve key performance breakthroughs within strict timelines, requiring hands-on experience with X-ray based metrology in the semiconductor industry.
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Key Responsibilities
- Own applications and develop processes for new nodes, demonstrating X-ray metrology techniques to enable robust process control.
- Identify and provide solutions for inline detection in collaboration with process engineering, emphasizing non-destructive X-ray methods for buried or high-aspect-ratio structures.
- Identify modeling opportunities using metrology and detection data to explain electrical failure signatures at probe, integrating X-ray and SEM data when applicable.
- Collaborate with the HVM Metro team on technology choices for upcoming nodes, translating device needs into clear equipment roadmap requirements regarding X-ray metrology capability gaps and scaling.
Requirements
- Bachelor's or Master's degree in Material Science, Physics, or a related field.
- Demonstrated experience with X-ray based metrology techniques, materials characterization, and data analysis within a semiconductor manufacturing or development environment.
- Basic knowledge of operating, troubleshooting, and hands-on experience with X-ray metrology tools (e.g., XRF, XRR, XRD, SAXS, X-ray CD, or X-ray imaging systems).
- Strong analytical and problem-solving skills with a focus on continuous improvement.
- Proven ability to collaborate effectively within multidisciplinary teams.
- Strong communication skills.