About the role
AI summarisedThis learning-focused technical internship provides hands-on exposure to Physical Failure Analysis (PFA) methodologies specific to complex three-dimensional NAND (3D-NAND) flash memory structures. The intern will study historical case studies to understand the technical factors influencing analysis complexity and cycle time variability in PFA workflows.
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Key Responsibilities
- Review and study historical, de-identified PFA case studies related to 3D-NAND technologies.
- Learn about the structure and sequencing of PFA workflows under close supervision.
- Observe how engineers evaluate analysis efficiency from a technical perspective.
Requirements
- Interest in Physical Failure Analysis (PFA) within advanced semiconductor devices.
- Willingness to learn complex analysis methods used in vertically stacked structures (3D-NAND).
- Ability to follow technical procedures under close supervision.