About the role
AI summarisedJoin the High Bandwidth Memory (HBM) Product & System Engineering Media Health team to drive innovation in reliability testing for Micron’s latest HBM products. This role involves developing and executing intrinsic and extrinsic reliability test programs, ensuring product quality, cost efficiency, and cycle time targets are met through advanced coding and comprehensive testing.
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Key Responsibilities
- Develop new reliability test flows (e.g., extended wafer level burn in, pWLRx, ELFR) for both DRAM and Interface die and stacked products.
- Perform intrinsic and extrinsic reliability assessment to meet critical KPIs regarding Quality, Cost, and Cycle Time.
- Conduct root cause analysis and resolution for issues encountered in reliability test programs.
- Promote innovation by developing new reliability features, solutions, or optimizing code infrastructure to maintain a competitive technical advantage.
- Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
- Utilize in-house statistical tools for engineering data analysis to validate performance and assess risk.
- Define interface hardware specifications and perform validation/debug on new interface boards.
Requirements
- Bachelor's or Master's degree in Electrical & Electronics Engineering, Computer Science, or a related field, or equivalent experience.
- Strong proficiency in coding/programming languages such as Python and C++.
