About the role
AI summarisedJoin Micron Technology, a global leader in memory and storage solutions, to drive innovation in advanced packaging technologies. This role focuses on developing and optimizing assembly processes for high-performance memory products, ensuring quality, yield improvement, and successful product transfers to high volume manufacturing.
IDMOnsiteHIG
Key Responsibilities
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking (Chip on Wafer, Chip to Wafer).
- Drive product quality improvements by enhancing yield, reducing costs, and increasing productivity.
- Establish and improve process management projects to meet demanding technology node requirements.
- Evaluate and promote new equipment and materials to enhance overall process capabilities.
- Set up precise process parameters for various semiconductor equipment.
- Ensure defense coverage through rigorous process, measurement, inspection, and testing protocols.
- Collaborate with cross-functional teams (Package Integration, Assembly Engineering, Front End Wafer Fab, etc.) to integrate manufacturing processes for optimal performance.
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to High Volume Manufacturing.
Requirements
- Bachelor’s or advanced degree in Engineering or Science.
- Strong analytical, logical, and critical thinking skills.
- Effective communicator capable of collaborating across all organizational levels.
- Growth mindset with a demonstrated passion for continuous learning.
- Interest in and knowledge of the semiconductor industry is preferred.
- Demonstrated leadership and a track record of impact are highly desirable.