About the role
AI summarisedThe PDE Process Integration (PI) Engineer drives process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI). This role ensures robust process readiness, yield ramp, and cross-module integration across Post Wafer Finishing (PWF), assembly, and test, enabling successful execution of HBM technology roadmaps.
IDMOnsiteAssembly & Test
Key Responsibilities
- Execute assigned HBM NPI PI tasks following defined procedures and phase-gate requirements
- Support NPI builds through lot tracking, data collection, and readiness activities
- Assist with NPI-to-High Volume Manufacturing (HVM) handoff activities and documentation
- Support and execute process characterization, Design of Experiments (DOEs), and window studies
- Perform yield, defect, and variability analysis using established methods
- Support root cause analysis (RCA) and corrective action implementation for scoped issues
- Work with Fab, Assembly, Test, Yield, and Quality teams on assigned integration scope
- Communicate status, risks, and issues clearly to senior engineers and stakeholders
- Prepare and maintain technical documentation, trackers, and summaries
Requirements
- Bachelor’s or master’s degree in engineering or related discipline
- 0–2 years of relevant experience in semiconductor manufacturing, process, or product engineering
- Basic understanding of semiconductor process flows and process integration concepts
- Familiarity with data analysis and basic statistics (Excel preferred)
- Ability to follow defined NPI procedures and phase-gate requirements
- Strong analytical, logical, and critical thinking skills
- Effective communicator capable of collaborating across all levels
- Growth mindset with a passion for continuous learning